发明名称 |
ESD protection scheme for semiconductor devices having dummy pads |
摘要 |
A semiconductor device formed in a semiconductor substrate for dissipating electrostatic discharge and/or accumulated charge in an integrated circuit is provided. In one embodiment, the device comprises a semiconductor substrate; a plurality of layers of metal lines formed overlying the substrate; a plurality of via plugs through intermetal dielectric layers between the layers of metal lines and wherein the via plugs interconnect the metal lines; and a dummy pad formed over the plurality of layers of metal lines, the dummy pad having a diode connected thereto and to ground for providing a discharge path for the electrostatic discharge and/or accumulated charge.
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申请公布号 |
US2008174923(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20070812221 |
申请日期 |
2007.06.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WU YI-HSUN;JIANG YAN-CHIH;LIN YU-CHANG;LEE JIAN-HSING |
分类号 |
H02H9/00;H01L21/336 |
主分类号 |
H02H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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