发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To accurately obtain a signal decay amount of a differential wiring in a multilayer printed wiring board which has a plane divided by a slit in an inner layer and has a differential wiring, disposed crossing to the slit in an outer layer, and to obtain a multilayer printed wiring board where the signal decay amount is proper. SOLUTION: The multilayer printed wiring board has a plane divided by a slit in an inner layer and has a differential wiring (hereinafter, to be referred to as a slit cross differential wiring), disposed crossing the slit in the outer layer. In the multilayer printed wiring board, a signal decay amountα<SB>total</SB>of the slit cross differential wiring is calculated by Formula (1), and the slit cross differential wiring is set so thatα<SB>total</SB>lies within a prescribed range. In the Formula (1),Δαis expressed by Formula (2). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008172036(A) 申请公布日期 2008.07.24
申请号 JP20070003959 申请日期 2007.01.12
申请人 AICA KOGYO CO LTD 发明人 TAKAHASHI IPPEI;TANAKA AKIHIRO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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