| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the overall dimensions of a counterpart substrate, when a flexible substrate is connected with the counterpart substrate through soldering by reducing the area of a dead space generated in the counterpart substrate, when it is covered with the flexible substrate. <P>SOLUTION: Solder lands 61 and 62 of a flexible substrate 5 are soldered to the solder lands 21 and 22 of a counterpart substrate 1. In the flexible substrate 5, a cut 7 or a slit 8 formed to reach the tip of a pattern of electric path, starting from the intermediate portion thereof in the routing direction R, is divided into two branch piece portions 71 and 72. Mutual interval of the solder lands 61, 62 of each piece portion 71, 72 is matched with the interval of the solder lands 21, 22 at the two positions of the counterpart substrate 1, by mutually superimposing the divided piece portion 71, 72 of the flexible substrate 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
