| 摘要 |
PURPOSE:To form the resist pattern without causing conventional side etching in a fine metal working using a chemical process by a method wherein a copper surface and a polymer having a group coordinating with copper are either brought into contact or heated via an intermediate object, so that a nonsoluble coating layer is formed on the contact surface. CONSTITUTION:In the fine metal working using the chemical process, the copper surface and the polymer having group coordinating with copper (e.g. polymer of vinyl monomer having nitrile or amino group) are brought into contact (by coating and drying). Alternatively, the copper surface and the polymer are separated by an intermediate object (metal or polymer having no group coordinating with copper) and then heated. In both the processes, a nonsoluble layer is formed on the contact surface. Then, a solvent such as chloroethane is used do dissolve the part of polymer not contacting the copper. If necessary, the intermediate object is dissolved by a proper solvent to form a desired resist film. |
