发明名称 |
REFRIGERATION SYSTEM INCLUDING THERMOELECTRIC MODULE |
摘要 |
<p>A refrigeration system for multi-temperature and single-temperature applications combines a refrigeration circuit and a single-phase fluid heat-transfer circuit in heat-conducting contact through a thermoelectric device. A vapor compression cycle provides a first stage of cooling and the thermoelectric device in conjunction with the heat-transfer circuit provides the second stage of cooling. Polarity of the thermoelectric device can be reversed to provide a defrost function for the refrigeration system.</p> |
申请公布号 |
EP1946024(A1) |
申请公布日期 |
2008.07.23 |
申请号 |
EP20060816721 |
申请日期 |
2006.10.11 |
申请人 |
EMERSON CLIMATE TECHNOLOGIES, INC. |
发明人 |
PHAM, HUNG M.;WARNER, WAYNE R. |
分类号 |
F25D19/00;F25B21/02;F25D11/02 |
主分类号 |
F25D19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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