发明名称 REFRIGERATION SYSTEM INCLUDING THERMOELECTRIC MODULE
摘要 <p>A refrigeration system for multi-temperature and single-temperature applications combines a refrigeration circuit and a single-phase fluid heat-transfer circuit in heat-conducting contact through a thermoelectric device. A vapor compression cycle provides a first stage of cooling and the thermoelectric device in conjunction with the heat-transfer circuit provides the second stage of cooling. Polarity of the thermoelectric device can be reversed to provide a defrost function for the refrigeration system.</p>
申请公布号 EP1946024(A1) 申请公布日期 2008.07.23
申请号 EP20060816721 申请日期 2006.10.11
申请人 EMERSON CLIMATE TECHNOLOGIES, INC. 发明人 PHAM, HUNG M.;WARNER, WAYNE R.
分类号 F25D19/00;F25B21/02;F25D11/02 主分类号 F25D19/00
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