| 摘要 |
A radiation sensitive resin composition, a method for forming an interlayer insulation layer by using the composition, and a method for forming a microlens by using the composition are provided to improve radiation sensitivity, development margin and adhesion. A radiation sensitive resin composition comprises (A) a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an unsaturated compound containing an epoxy group and/or an oxetanyl group, and (a3) at least one other unsaturated compound different from (a1) and (a2) and selected from the group consisting of an unsaturated compound having an alkyl methacrylate, an alkyl acrylate, a cyclic alkyl methacrylate, a methacrylate having a hydroxyl group, a cyclic alkyl acrylate, an aryl methacrylate, an aryl acrylate, an unsaturated dicarboxylate, a bicyclo unsaturated compound, a maleimide compound, an unsaturated aromatic compound, a conjugated diene, a tetrahydrofuran structure, a furan structure, a tetrahydropyran structure, a pyran structure or a structure represented by the formula 3, and an unsaturated compound containing a phenolic hydroxyl group represented by the formula I; (B) a 1,2-quinonediazide compound; and (C) a siloxane oligomer containing a functional group crosslinking with the (A) component by heat, wherein R1 is H or a C1-C4 alkyl group; R2 to R6 are identical or different one another and are H, OH or a C1-C4 alkyl group; B is a single bond, -COO- or -CONH-; and m is an integer of 0-3. |
