| 摘要 |
A light emitting device package and a method for manufacturing the same are provided to maintain uniform dispersion of a fluorescent body by uniformly dispersing beads in which filler is coated with the fluorescent body. A light emitting device package includes a package body, a filler(5'), and a lens. An LED chip is mounted on the package body. The filler is positioned on the package body. Beads(8) are uniformly dispersed into the filler. The beads are coated with a fluorescent(7). The lens is installed on the filler. The filler is made by silicon or epoxy. The beads are silicon type glass. A reflective index of the beads is changed according to materials of the filler. A diameter of the beads is changed according to the size of the LED chip.
|
