| 发明名称 |
APPARATUS AND METHOD FOR MEASURING TOOL DEGRADATION |
| 摘要 |
<p>A machining apparatus (<HIL><PDAT>10</BOLD><PDAT>) comprises a material removing tool (<HIL><PDAT>12</BOLD><PDAT>) movably mounted for removing material from a workpiece (<HIL><PDAT>14</BOLD><PDAT>); means for illuminating (<HIL><PDAT>42, 54</BOLD><PDAT>) a sample area upon a tool surface (<HIL><PDAT>34</BOLD><PDAT>) with excitation radiation; means for receiving (<HIL><PDAT>42, 54</BOLD><PDAT>) sample light emitted from the sample area; a spectral analyzer (<HIL><PDAT>54</BOLD><PDAT>) for performing a spectral analysis of the sample light received; and means for determining (<HIL><PDAT>60</BOLD><PDAT>) the condition of the tool at the sample area from the spectral analysis of the sample light. The wear of the tool (<HIL><PDAT>12</BOLD><PDAT>) is determined as such a condition. Operation parameters of the machining apparatus (<HIL><PDAT>10</BOLD><PDAT>) are adjusted according to the determined wear. An example application is a wafer dicing tool.</PTEXT></p> |
| 申请公布号 |
EP1399291(B1) |
申请公布日期 |
2008.07.23 |
| 申请号 |
EP20020729106 |
申请日期 |
2002.05.02 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC.;INFINEON TECHNOLOGIES SC300 GMBH & CO. KG |
发明人 |
ROESNER, MICHAEL;SCHNEEGANS, MANFRED;WALLIS, DAVID |
| 分类号 |
B23Q17/09;B23Q17/24;B24B21/04;B24B27/06;B24B37/005;B24B49/12;B24B49/18;B28D5/00;G01N21/65 |
主分类号 |
B23Q17/09 |
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