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发明名称
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
摘要
申请公布号
EP1946362(A2)
申请公布日期
2008.07.23
申请号
EP20060801412
申请日期
2006.08.14
申请人
ENTHONE, INCORPORATED
发明人
RICHARDSON, THOMAS, B.;KLEINFELD, MARLIES;RIETMANN, CHRISTIAN;ZAVARINE, IGOR;STEINIUS, ORTRUD;ZHANG, YUN;ABYS, JOSEPH, A.
分类号
H01L21/445;C25D3/60;C25D3/64
主分类号
H01L21/445
代理机构
代理人
主权项
地址
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