| 摘要 |
This invention provides a heat sink module that has good thermal conductivity, is less likely to cause problems such as separation, is highly reliable, and, despite the provision of a satisfactorily heat dissipatable mechanism, can realize space saving. The heat sink module (10) comprises two or more heat conducting parts (5a, 5b), each comprising a heat sink layer (1) formed of a heat sink material having a coefficient of thermal expansion of 1 x 10-6 to 8 x 10-6/K, an intermediate layer (2) formed of Cu, a Cu alloy, Al or an Al alloy, an electrically insulating layer (3), and an electrode layer (4) formed of Cu, a Cu alloy, Al or an Al alloy stacked on top of each other, and joined by a first brazing material, and a heat radiation cooling part (7) comprising two or more installation faces (45). The heat radiation cooling part (7) in its at least installation faces (45) are formed of Cu, a Cu alloy, Al or an Al alloy. The two or more heat conducting parts (5a, 5b) are joined onto the two or more installation faces (45) by a second brazing material in such a state that the heat sink layers (1) are disposed. |
