| 摘要 |
<p>An adhesive sheet for processing a semiconductor wafer is provided to realize a stable drop in adhesion after the irradiation of UV rays or radiation beams, to prevent defects in the following pick-up step, and to leave no paste residue on the surface of a resin. An adhesive sheet for processing a semiconductor wafer comprises: a substrate transmittable to UV rays and/or radiation beams, and an adhesive layer polymerizable and curable by UV rays and/or radiation beams, wherein the adhesive layer is formed by using a multi-functional acrylate oligomer and/or monomer having a double bond, and is combined to have one double bond and a total average molecular weight of 225-8000 as calculated from the weight average molecular weight of the combination of the multi-functional acrylate oligomer and/or monomer.</p> |
