发明名称 Method of forming chromium coated copper for printed circuit boards
摘要 <p>A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 ANGSTROM and about 70 ANGSTROM ; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby. <IMAGE></p>
申请公布号 EP1123988(B1) 申请公布日期 2008.07.09
申请号 EP20000204364 申请日期 2000.12.07
申请人 NIKKO MATERIALS USA, INC. 发明人 WANG, JIANGTAO;CALLAHAN, JOHN;LILLIE, DAN
分类号 C23C14/02;C25D11/38;C23C2/02;C23C2/26;C23C16/06;C23C22/24;C23C22/82;C23C28/00;C25D5/48;C25D7/00;C25D9/08;H05K3/14;H05K3/24;H05K3/38 主分类号 C23C14/02
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