发明名称 |
Thermal coupling of matched SOI device bodies |
摘要 |
Performance matching devices in SOI are improved by thermally isolating matched devices within a continuous body of active material. Matched devices are isolated by an insulating wall of silicon dioxide (which surrounds the devices) and the oxide layer beneath, and are arranged to minimize effects from external thermal sources.
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申请公布号 |
US7397085(B2) |
申请公布日期 |
2008.07.08 |
申请号 |
US20010007332 |
申请日期 |
2001.11.08 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MARSHALL ANDREW |
分类号 |
H01L27/12;H01L27/02;H01L27/11 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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