| 发明名称 |
Wiring board and semiconductor package using the same |
| 摘要 |
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 mum and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as D<SUB>T </SUB>(GPa) and a breaking strength at a temperature of T° C. is given as H<SUB>T </SUB>(MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less (2) D<SUB>23</SUB>>=5 (3) D<SUB>150</SUB>>=2.5 (4) (D<SUB>-65</SUB>/D<SUB>150</SUB>)<=3.0 (5) H<SUB>23</SUB>>=140 (6) (H<SUB>-65</SUB>/H<SUB>150</SUB>)<=2.3.
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| 申请公布号 |
US7397000(B2) |
申请公布日期 |
2008.07.08 |
| 申请号 |
US20050125158 |
申请日期 |
2005.05.10 |
| 申请人 |
NEC CORPORATION;NEC ELECTRONICS CORPORATION |
发明人 |
SHIMOTO TADANORI;KIKUCHI KATSUMI;MURAI HIDEYA;BABA KAZUHIRO;HONDA HIROKAZU;KATA KEIICHIRO |
| 分类号 |
H01L23/12;H05K1/00;H01L21/48;H01L21/68;H01L23/14;H01L23/498;H01L25/065;H05K1/03;H05K1/11;H05K3/20;H05K3/42 |
主分类号 |
H01L23/12 |
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