| 摘要 |
A method of packaging an integrated circuit die including forming a mask window having a first aperture with a first set of alignment edges and forming an alignment feature on an uppermost surface of the integrated circuit die where the alignment feature has a second set of alignment edges. The alignment feature is inserted into the first aperture. The integrated circuit die is mechanically biased until the first and second set of alignment edges are in physical contact with one another and the alignment feature is secured into the mask window, thus forming an integrated circuit die assembly.
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