PHOTORESIST COMPOSITION AND PATTERN FORMATION METHOD

摘要

Disclosed is a photoresist composition which does not cause any cracking or the like on a resist pattern during plating even when no plasticizer is contained, and which enables to form a resist film having no wrinkling and a uniform film thickness. Specifically disclosed is a photoresist composition comprising: (A) an alkali-soluble novolac resin wherein one or some of hydrogen atoms contained in a phenolic hydroxyl group is/are substituted by a substituent having a structure represented by the general formula (2); and (B) a photosensitizing agent.