| 摘要 |
A semi-thermosetting anisotropic conductive film composition is provided to improve cutting property, compression property, compression reworkability, the reliance for a long time and the stability of adhesive strength. A semi-thermosetting anisotropic conductive film composition comprises 100 parts by weight of a thermoplastic resin having a weight average molecular weight of 150,000-600,000; 100-400 parts by weight of a thermosetting material having an acrylate or methacrylate functional group and having a weight average molecular weight of 100-10,000; 0.3-10 parts by weight of an organic peroxide; a silane coupling agent; and a conductive particle.
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