| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module in which a terminal element is elastically formed in a spring form and protected from coming off and a power semiconductor module can be easily manufactured. <P>SOLUTION: The power semiconductor module comprises: a terminal element (7) formed as a contact spring (70) having a first contact device (72), an elastic portion (74) and a second contact device (76); a housing (3) having a hole (30) having a first portion hole and a second portion hole (32, 34) each for receiving the contact spring (70), a first contact device (72) of the contact spring (70) being formed into a pin, a diameter (D) of the second portion being smaller than the sum of a diameter (DF) of the pin-like first contact device (72) and a deviation quantity (A) to be decided by deformation portions (720, 722) of the first contact device (72); and the deformation portions (720, 722) being disposed between the second portion hole (34) and a substrate (5). <P>COPYRIGHT: (C)2008,JPO&INPIT |
