| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing blade capable of preventing or reducing the chipping of a semiconductor chip, cracks, the film peeling of a circuit surface and the damages to the blade. SOLUTION: The dicing blade has a structure making the inner peripheral thickness of an annular edge for the dicing blade thinner than an outer peripheral thickness and forming stepped sections 8 in the thickness direction, at the inflection points of an annular-edge inner peripheral section 1 and an annular-edge outer peripheral section 2. Consequently, it reduces the pushing and narrowing between the annular-edge side face of the dicing blade and the cutting surface 6 of the semiconductor chip of cutting chips generated during dicing and attains the effects where the chipping of the semiconductor chip 4, cracks, film peelings of the circuit surface and damages to the blade are prevented or reduced. COPYRIGHT: (C)2008,JPO&INPIT |
