| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an individualizing apparatus for individualizing a sealed substrate to manufacture an electronic component, capable of shortening delivery period, reducing footprint and reducing cost while accepting a requirement specification of users. <P>SOLUTION: An individualizing apparatus S2 for an electronic component has a basic unit including an acceptor A and an individualizing part B and a delivery part C, a cleaner D equipped between the individualizing part B and the delivery part C, and an inspector E equipped to the cleaner D. The individualizing part B is arbitrarily selected depending on a requirement specification of users. A cutting-off mechanism used in the individualizing part B has a rotary blade 7, a waterjet, laser light, a wire saw, a band saw and the like. In addition, the cleaner D and the inspector E equipped to the basic unit are arbitrarily selected and equipped depending on the requirement specification of users, respectively. By equipping the cleaner D and the inspector E to the basic unit having the individualizing part B depending on the requirement specification of users, the individualizing apparatus S2 for an electronic component is configured. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
