发明名称 DIE FOR MATERIAL MOLDING, MATERIAL MOLDING METHOD AND MATERIAL MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a die in which the change in the temperature of the surface in a cavity for material molding is reduced as possible, further, a suitable temperature distribution is obtained therein, and a sound produce in which a defect in gas involvement or the like is reduced can be economically produced, and to provide a working method and a device utilizing the same. SOLUTION: A phase changing substance 2 absorbing latent heat in the vicinity of a temperature to which it is desirably held constant, and dissolved is arranged at a position close to the surface 1a of a cavity, and the phase changing substance is cooled, and heat is released to the outside of the die. If required, a flow passage 3 is further provided between the phase changing substance and the cavity 1, after a workpiece is packed into the cavity 1, water, heat resistant oil or the like are made to flow through the flow passage, and it is cooled to a product discharging temperature. If required, a phase changing substance with a different melting point is dispersedly arranged in the die, and a suitable temperature distribution is produced in the workpiece. By utilizing the die, the workpiece is inserted into the cavity at a low velocity in which air involvement or the like do not occur. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008149372(A) 申请公布日期 2008.07.03
申请号 JP20060357237 申请日期 2006.12.13
申请人 IE SOLUTION KK 发明人 ONAKA ITSUO
分类号 B22D17/22;B22C1/00;B22C9/06;B29C33/02;B29C33/38 主分类号 B22D17/22
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