| 摘要 |
<p>A bidirectional switch module is provided to reduce costs by placing semiconductor devices having junction electrodes of the same potential on metal base plates directly. A bidirectional switch module comprises a bidirectional switch circuit, at least one metal base plate to be heat dissipation plates, a first semiconductor device, and a second semiconductor device. The bidirectional switch circuit wherein a current flows bidirectionally is combined with plural semiconductor elements. The first semiconductor device having a junction electrode connected to a first node of the bidirectional switch circuit is mounted on the metal base plate. The second semiconductor device having a junction electrode to be connected to a second node of the bidirectional switch circuit is mounted on the metal base plate. The junction electrodes of the first and second semiconductor devices have the same potential as that of the metal plate. The metal base plate and non-junction electrodes of the semiconductor devices are respectively connected by metal thin wires.</p> |
