| 摘要 |
A method of forming a pattern is provided to form an adhesion layer using a pattern formation material on the surface of a soft mold before the soft mold comes into contact with the pattern formation material to prevent repulsion between the soft mold and the pattern formation material. A substrate(100) on which a pattern formation material is coated is loaded into a chamber(300). A soft mold(210) including a pattern forming part having an uneven surface is located above the substrate in the chamber. Some of the pattern formation material is evaporated to form an adhesion layer(120b) on the surface of the soft mold. The soft mold including the adhesion layer is brought into contact with the remaining pattern formation material(120a) to form a pattern layer in a pattern corresponding to the protrusions/depressions of the uneven surface of the soft mold. The soft mold is separated from the pattern layer.
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