| 发明名称 |
CMP method for gold-containing substrates |
| 摘要 |
The invention provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with a cyanide-free chemical-mechanical polishing (CMP) composition.
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| 申请公布号 |
US2008156774(A1) |
申请公布日期 |
2008.07.03 |
| 申请号 |
US20080075019 |
申请日期 |
2008.03.07 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
BRUSIC VLASTA;ZHOU RENJIE;THOMPSON CHRISTOPHER |
| 分类号 |
B44C1/22 |
主分类号 |
B44C1/22 |
| 代理机构 |
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