Flux spray atomization and splash control

摘要

Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.