| 发明名称 |
Strip patterned transmission line |
| 摘要 |
A semiconductor package has a substrate. The substrate comprises a set of interconnects. An dielectric material may be provided under one or more of the interconnects to adjust the impedance of transmission line.
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| 申请公布号 |
US2008157335(A1) |
申请公布日期 |
2008.07.03 |
| 申请号 |
US20060648421 |
申请日期 |
2006.12.28 |
| 申请人 |
TANG JIA MIAO;ZENG XIANG YIN;LU DAO QIANG;HE JIANG QI |
发明人 |
TANG JIA MIAO;ZENG XIANG YIN;LU DAO QIANG;HE JIANG QI |
| 分类号 |
H01L23/52;H01L21/4763 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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