发明名称 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND METHOD FOR PRODUCTION THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit connecting material that has excellent connection reliability and connection appearance by inhibiting the peeling on the interface between the circuit member and the circuit connecting part, as maintaining good conductivity between the opposing electrodes and the adhesive strength between the opposing circuit members. <P>SOLUTION: This circuit connecting material is for allowing the first circuit member 20 on which a plurality of first circuit electrodes 22 are formed on the major surface 21a of the first circuit board 21, and the second circuit member 30 on which a plurality of second circuit electrodes 32 are formed on the major surface 31a of the second circuit board 31 to be electrically connected so that the first and the second circuit electrodes 22 and 32 may oppose to each other. Further, the circuit connecting material contains an adhesive composition 40, conductive particles 53, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particle 51. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008150573(A) 申请公布日期 2008.07.03
申请号 JP20070160577 申请日期 2007.06.18
申请人 HITACHI CHEM CO LTD 发明人 TATEZAWA TAKASHI;KOBAYASHI KOJI;FUKUSHIMA NAOKI;KOBAYASHI TAKANOBU;ITO AKIHIRO
分类号 C09J201/00;C09J9/02;C09J11/04;H01B1/22;H01L21/60;H05K1/14;H05K3/32;H05K3/36 主分类号 C09J201/00
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