CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board in which a metal plate liquid-cooled is set to be a core substrate and which has a via connecting wiring boards arranged on both faces of the core substrate. SOLUTION: A through hole 18 is formed in a partition wall 11b arranged between passages 21a of the core substrate 21, and the via 14 is formed in an insulator 16 with which the through hole 18 is filled, or the core substrate is constituted of a vapor chamber, and is sealed with a metal pipe which is engaged with the through hole passing through the core substrate. The via is formed in the insulator with which the metal pipe is filled. The via 14 is insulated from the metallic core substrate 21 and it can be formed in an arbitrary position in a face of the core substrate 21. COPYRIGHT: (C)2008,JPO&INPIT