| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for dicing, where cut refuse (thread-shaped or whisker-shaped refuse generated from the film after dicing) scarcely occurs in the dicing process of a semiconductor wafer, and to provide a dicing film. SOLUTION: In the substrate film for multilayer dicing, a first layer includes a resin composition made of 30-80 wt.% of styrene-butadiene copolymer (SEBS) and 20-70 wt.% of polypropylene-based resin (PP); a second layer includes a resin composition made of 10-70 wt.% of polypropylene-based resin (PP) and 30-90 wt.% of amorphous olefin; and a third layer includes a thermoplastic resin having rubber elasticity, where the first to third layers are laminated in this order. COPYRIGHT: (C)2008,JPO&INPIT |
