| 摘要 |
PROBLEM TO BE SOLVED: To prevent chipping on a rear surface in dicing a wafer into devices. SOLUTION: A glass plate 1 is stuck on the rear surface W2 of a wafer W via an adhesive layer 2a having an adhesive force to be deteriorated due to an applied external stimulus, and the wafer W is divided into individual devices D by cutting dividing lines from the surface W1 of the wafer W. Then, the glass plate 1 is removed and the devices D are each picked up. Since the wafer W is cut in a state where the rear surface W2 of the wafer W is held in the glass plate 1, vibration of a cutting blade 31a is absorbed with the glass plate 1 fixed on the rear surface of the wafer W, minute vibration of the rear surface W2 of the wafer W is suppressed and chipping of the wafer W can be prevented. COPYRIGHT: (C)2008,JPO&INPIT |
