发明名称 RESISTIVE MEMORY ELEMENT, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resistive memory element and its manufacturing method. SOLUTION: This resistive memory element comprises: a contact plug 207 which is formed by passing through an interlayer insulating film 206 on the source 202 or the drain 203 of a transistor; an lower electrode 21 connected to the contact plug 207; a solid solution layer 24 which is formed on the lower electrode 21 with a transition metal solid solution; a resistive layer 22 which is formed on the solid solution layer 24 with a transition metal oxide; and an upper electrode 23 formed on the resistive layer 22. From this structure, a memory element being stable in voltage and resistance characteristics, and having high reliability is provided. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008153633(A) 申请公布日期 2008.07.03
申请号 JP20070297209 申请日期 2007.11.15
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE MYOUNG-JAE;PARK YOUNG SOO;JUNG RAN-JU;SEO SUN-AE;KIM DONG-CHUL;AHN SEUNG-EON
分类号 H01L27/10;C23C14/34;H01L21/203;H01L45/00;H01L49/00 主分类号 H01L27/10
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