发明名称 |
RESISTIVE MEMORY ELEMENT, AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resistive memory element and its manufacturing method. SOLUTION: This resistive memory element comprises: a contact plug 207 which is formed by passing through an interlayer insulating film 206 on the source 202 or the drain 203 of a transistor; an lower electrode 21 connected to the contact plug 207; a solid solution layer 24 which is formed on the lower electrode 21 with a transition metal solid solution; a resistive layer 22 which is formed on the solid solution layer 24 with a transition metal oxide; and an upper electrode 23 formed on the resistive layer 22. From this structure, a memory element being stable in voltage and resistance characteristics, and having high reliability is provided. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008153633(A) |
申请公布日期 |
2008.07.03 |
申请号 |
JP20070297209 |
申请日期 |
2007.11.15 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
LEE MYOUNG-JAE;PARK YOUNG SOO;JUNG RAN-JU;SEO SUN-AE;KIM DONG-CHUL;AHN SEUNG-EON |
分类号 |
H01L27/10;C23C14/34;H01L21/203;H01L45/00;H01L49/00 |
主分类号 |
H01L27/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|