| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method capable of preventing corrosion and deterioration by improving adhesion in an interface between an electronic component and a resin and between resins. SOLUTION: The sealing method seals the electronic component 10 with a curing resin 4 and seals the surface of the curing resin 4 with a first powdered thermoplastic resin composition 5 mainly containing a predetermined thermoplastic resin. Next, the curing resin 4 is cured. Next, the surface of the first thermoplastic resin composition 5 is sealed with a second thermoplastic resin composition 6 having a predetermined thermoplastic resin. COPYRIGHT: (C)2008,JPO&INPIT
|
