| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymerizable composition capable of preparing a crosslinkable resin suitable as an electric material, etc., used for electronic circuit substrates and the crosslinkable resin prepared by using the polymerizable composition, and to provide a method for producing those and to provide applications such as crosslinked products, composites, laminates, etc., excellent in characteristics such as electrical insulating properties, adhesiveness, mechanical strength, heat resistance and dielectric properties. SOLUTION: The polymerizable composition comprises a norbornene-based monomer, a metathesis polymerization catalyst and a peroxide having a structure represented by the formula (A). A crosslinked resin composite is prepared by applying the polymerizable composition to a support or impregnating the support with the composition and carrying out bulk polymerization of the polymerizable composition, to provide a crosslinkable resin composite, and crosslinking the composite. COPYRIGHT: (C)2008,JPO&INPIT
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