MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIVE SPACING STRUCTURES

摘要

A mountable integrated circuit package-in-package system with adhesive spacing structures is provided to remove cracks of interface by preventing an adhesive spacer from being contacted with an inner capsule. A mountable integrated circuit package-in-package system with adhesive spacing structures comprises the steps of: mounting an adhesive spacer(208) on an integrated circuit die(202) and a package substrate(204); mounting an integrated circuit package system(106) having an integrated inner structure(218) to place the integrated inner structure on the adhesive spacer; and forming a package capsule(102) to cover the integrated package system on the adhesive spacer.