| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a novel and improved semiconductor device wherein electrode pads 108 formed on a semiconductor chip and a substrate 120 for products can be collectively connected, and also to provide a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device includes the semiconductor chip 104 formed with the electrode pads 108, a package mounting substrate 102 whereon the semiconductor chip 104 is mounted and sealed, and metal columns 114 to be electrically connected to the electrode pads 108 of the semiconductor chip 104. The semiconductor chip 104 is fixed on the package mounting substrate 102 with the electrode pad formation surface facing the package mounting substrate 102. The package mounting substrate 102 is formed with through-holes 112 at positions corresponding to the electrode pads 108. The metal columns 114 are inserted into the through-holes 112 of the package mounting substrate 102 and then are connected to the electrode pads 108 of the semiconductor chip 104. The metal columns 114 is also projected from the package mounting substrate 102 and are fixed by sealing. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
