发明名称 |
STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE |
摘要 |
A contact grid array interconnect element for mounting an IC package to a substrate. The interconnect comprises an insulating stand-off post having opposing ends. An electrically conductive core is embedded in and traverses the post. Conductive endplates are located on the opposing ends of the post and contact the core.
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申请公布号 |
US2008158842(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20060617895 |
申请日期 |
2006.12.29 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
STIBOREK LEON |
分类号 |
H05K7/00;H01L21/58;H05K1/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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