发明名称 PRINTED WIRING BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board capable of preventing rise in a resistance value of a conductor pattern and disconnection due to repetitive contact of the conductive pattern to the portions of an electronic apparatus, and to provide a manufacturing method thereof and an electronic apparatus having the same. SOLUTION: A conductor pattern 2a is formed on a base insulating layer 1 of a printed wiring board 100, and a cover insulating layer 4 is formed on the base insulating layer 1 via an adhesive layer 3 so as to cover the conductor pattern 2a. An unevenness 5 is formed on the surface of the cover insulating layer 4. The printed wiring board 100 is disposed in a case of the electronic apparatus in a state where the printed wiring board 100 is bent so that the cover insulating layer 4 is disposed outside. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008153478(A) 申请公布日期 2008.07.03
申请号 JP20060340661 申请日期 2006.12.19
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU
分类号 H05K1/02;H05K3/28 主分类号 H05K1/02
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