A METHOD FOR FABRICATING SIDE-VIEW LIGHT EMITTING DIODE PACKAGE

摘要

A method for manufacturing a side-view light emitting diode package is provided to improve the light emitting efficiency of a light emitting diode package by employing a lead terminal having a recessed unit. A first lead terminal(51) is formed. The first lead terminal has a base(51a), a recessed unit(51b) formed on a lower section from the base, and a first declined surface(51c) formed between the base and the recessed unit. The recessed unit defines a light emitting diode chip mounting region. A second lead terminal(53) is formed to be arranged adjacent to the first lead terminal. A package body supports the first and second terminals and has a long opening for exposing a part of the second lead terminal, and at least one of the first lead terminal and the first declined surface. The first and second lead terminals are formed from separated lead frames. The first lead terminal is extended from the recessed unit and further includes a second declined surface that is positioned opposite to the first declined surface and exposed in the opening unit. The second declined surface crosses a long axis direction of the opening unit and encounters with inner walls of a short axis direction of the package body or is terminated before being encountered therewith.