发明名称 A PCB, A MULTILAYER PCB HAVING FILLED-IN RESISTERS AND A MOBILE TERMINAL HAVING THE SAME
摘要 A PCB(Printed Circuit Board) and a multilayer PCB having a buried resistor, a mobile terminal having the same, and a method for manufacturing the PCB are provided to be unnecessary to remove a process of forming an additional hole by burying the resistor through disposing the resistor on a signal pattern and applying a prepreg. A method for manufacturing a PCB includes the steps of: disposing a resistor on a top surface of a lower conductive layer(S10); burying a lateral portion of the resistor in a resin layer by applying a prepreg to form the resin layer and exposing an upper end of the resistor(S12); forming an upper conductive layer in contact with a top surface of the resistor(S14); and forming a signal pattern so that the upper conductive layer is conducted to the top surface of the resistor by etching the upper conductive layer(S16).
申请公布号 KR20080061541(A) 申请公布日期 2008.07.03
申请号 KR20060136393 申请日期 2006.12.28
申请人 LG ELECTRONICS INC. 发明人 LEE, SANG KIL;KIM, TAE HYUN
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址