发明名称 |
A PCB, A MULTILAYER PCB HAVING FILLED-IN RESISTERS AND A MOBILE TERMINAL HAVING THE SAME |
摘要 |
A PCB(Printed Circuit Board) and a multilayer PCB having a buried resistor, a mobile terminal having the same, and a method for manufacturing the PCB are provided to be unnecessary to remove a process of forming an additional hole by burying the resistor through disposing the resistor on a signal pattern and applying a prepreg. A method for manufacturing a PCB includes the steps of: disposing a resistor on a top surface of a lower conductive layer(S10); burying a lateral portion of the resistor in a resin layer by applying a prepreg to form the resin layer and exposing an upper end of the resistor(S12); forming an upper conductive layer in contact with a top surface of the resistor(S14); and forming a signal pattern so that the upper conductive layer is conducted to the top surface of the resistor by etching the upper conductive layer(S16).
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申请公布号 |
KR20080061541(A) |
申请公布日期 |
2008.07.03 |
申请号 |
KR20060136393 |
申请日期 |
2006.12.28 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, SANG KIL;KIM, TAE HYUN |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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