发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME |
摘要 |
A semiconductor device includes a semiconductor substrate, a field effect transistor (FET), contact plugs, a resistive element (specific member) and interconnects. Contact plugs are connected to the FET. A resistive element is provided in the layer (lowermost layer of interconnect layer) that also includes the contact plug. The contact plug and the resistive element are formed of the same material. Portions of the upper surface of the resistive element are connected to the interconnects.
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申请公布号 |
US2008160686(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20070872797 |
申请日期 |
2007.10.16 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
NAKAMATSU IKUO;YASUDA MAKOTO;TAKEWAKI TOSHIYUKI;NAKASHIBA YASUTAKA;UCHIDA SHINICHI |
分类号 |
H01L21/8244;H01L21/20;H01L21/4763;H01L21/8238 |
主分类号 |
H01L21/8244 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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