发明名称 RADIATION CURABLE THERMAL TRANSFER ELEMENTS
摘要 <p>Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.</p>
申请公布号 KR20080063294(A) 申请公布日期 2008.07.03
申请号 KR20087007660 申请日期 2006.10.05
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 WRIGHT ROBIN E.;HUYNH KHANH T.;KREILICH LESLIE A.;LIU LAN HONG;SWANSON RACHEL K.;WALTER RICHARD L.;WOLK MARTIN B.;JOHNSON STEPHEN A.
分类号 H05B33/10 主分类号 H05B33/10
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