| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate having a built-in component in which its plane dimension and a height dimension can be remarkably reduced, and a manufacturing method of the substrate having a built-in component. <P>SOLUTION: The substrate 100 having a built-in component has a structure in which an electronic component 30 is disposed between at least two wiring boards 10, 20, the electronic component 30 is electrically connected to at least either of the wiring substrates, the wiring substrates 10, 20 are electrically interconnected, and a portion between the wiring substrates is sealed with a resin. Bonding pads 12 formed on one surface of the wiring substrate 10 are electrically connected to electrodes 32 of the electronic component 30 via bonding wires 60, and at least connection portions between the electrodes 32 of the electronic component 30 and the bonding wires 60 are covered with a protective material 70. <P>COPYRIGHT: (C)2008,JPO&INPIT |
