发明名称 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTORESIST COMPOSITION
摘要 <p>A chemically amplified positive resist composition, a resist film formed from the composition, and a method for forming a resist pattern by using the composition are provided to reduce residual film rate and standing wave phenomena and to improve profile and resolution. A chemically amplified positive resist composition comprises a resin represented by the formula 1; a photoacid generator represented by the formula 2, 3 or 4 or their mixture; and a quencher, wherein R1 is H or a methyl group; R2 is a C1-C10 linear, branched or cyclic alkyl group; a+b is 1; 0.50<=a/(a+b)<=0.90; and 0.1<=b/(a+b)<=0.50; X is a halogen atom; R3 is a halogen atom or a C1-C10 linear, branched or cyclic haloalkyl group; and R4 and R5 are a C3-C8 linear, branched or cyclic alkyl group substituted or unsubstituted with a hydroxyl group, an amino group, an alkoxy group or an aryl group, or a C6-C20 aryl group substituted or unsubstituted with a hydroxyl group, an amino group, an alkoxy group or an aryl group.</p>
申请公布号 KR20080060545(A) 申请公布日期 2008.07.02
申请号 KR20060134779 申请日期 2006.12.27
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 YOO, KYOUNG WOOK;PARK, HAN WOO
分类号 G03F7/039;G03F7/004 主分类号 G03F7/039
代理机构 代理人
主权项
地址