发明名称 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
摘要 |
The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of fabricating the same. In the wafer level chip size package, with such an n-shape junction instead of a conventional T-shape junction observed in Shellcase type wafer level chip size package technology, electrical connections between compatible pads and external leads are more reliable due to larger connection area than the counterpart in the T-shape junction. |
申请公布号 |
US7394152(B2) |
申请公布日期 |
2008.07.01 |
申请号 |
US20060559129 |
申请日期 |
2006.11.13 |
申请人 |
CHINA WAFER LEVEL CSP LTD. |
发明人 |
YU GUOQING;WANG YOUJUN;XU QINQIN;WANG QINGWEI;WANG WEI |
分类号 |
H01L31/05 |
主分类号 |
H01L31/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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