发明名称 |
IMAGINE SENSOR PACKAGE AND FORMING METHOD OF THE SAME |
摘要 |
<p>Imagine Sensor Package and Forming Method of the Same An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.</p> |
申请公布号 |
SG143242(A1) |
申请公布日期 |
2008.06.27 |
申请号 |
SG20070185192 |
申请日期 |
2007.12.10 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;CHANG JUI-HSIEN |
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