| 摘要 |
<p>An individuating device for producing an electronic component by individuating a sealed substrate in which an appointed date of delivery can be shortened, a footprint can be decreased in size and costs can be reduced while specifications requested by a user is met. The individuating device (S2) of an electronic component comprises a basic unit including a receiving section (A), an individuating section (B) and a delivery section (C), a cleaning section (D) attached between the individuating section (B) and the delivery section (C), and an inspection section (E) attached to the cleaning section (D). The individuating section (B) is selected properly depending on the specifications requested by a user, and the cutting mechanism used in the individuating section (B) has a rotary blade (7), a water jet, a laser beam, a wire saw, a band saw, and the like. The cleaning section (D) and the inspection section (E) attached to the basic unit is selected appropriately depending on the specifications requested by a user and attached. The individuating device (S2) of an electronic component is constituted by attaching the cleaning section (D) and the inspection section (E) to the basic unit having the individuating section (B) depending on the specifications requested by a user.</p> |
