| 摘要 |
A substrate baking apparatus is provided to effectively cool down an overall surface of a substrate by adopting a partial cooling scheme for a cooling plate. A substrate baking apparatus includes a chamber(101), plural cooling plates(110-140), and cooling lines(115-145). The chamber defines an enclosed space, where a substrate treating process is performed. The cooling plate directly supports one substrate. The cooling plates are arranged, such that the chamber is uniformly divided. The cooling line is arranged inside the cooling plate and provides a coolant circulating path. The cooling line is formed in a zigzag formation.
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