| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fixing means of a semiconductor light-emitting element which has a shape designed to prevent protrusion or projection (burr) of a surface thin film (metallize) generated on a fixing means by dicing and stabilizes heat dissipation by increasing a degree of adhesion between the semiconductor light-emitting element and the fixing means. <P>SOLUTION: The fixing means 10 has a horizontal top surface part 13 where a semiconductor light-emitting element 15 is fixed by bonding and a step 14 which is on a light emitting side of the semiconductor light-emitting element and is formed lower than the horizontal part. Consequently, a semiconductor light-emitting means is never tilted to the fixing means and fixed in close contact with the fixing means, thereby dissipating heat stably. <P>COPYRIGHT: (C)2008,JPO&INPIT |
