| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a heat dissipation substrate for electric circuit in which adhesion strength of an underlying insulation layer and a conductive metal film can be enhanced with regard to an aluminum-based heat dissipation substrate for electric circuit. SOLUTION: After forming an insulation layer having a porous layer on the surface by performing anodization of an aluminum base, a conductive metal film is formed on the insulation layer of the aluminum base by dry plating, e.g., sputtering or deposition, and then a conductive metal film is laminated thereon by electroplating. The conductive metal film formed by dry plating is constituted of a first layer consisting of at least one kind of Ni, Cr and Ti and a second layer of Cu formed thereon. Preferably, the conductive metal film formed by electroplating consists of Cu. COPYRIGHT: (C)2008,JPO&INPIT |
