| 摘要 |
The present invention concerns an element designed to interconnect at least two conductors of a microelectronic circuit, including: an initial conductor ( 210 ), referred to as lower conductor; a dielectric layer ( 230 ) situated on said initial conductor; a second conductor ( 220 ), referred to as upper conductor, on said dielectric layer; a cavity ( 240 ) in the dielectric layer emerging, on the one hand, on the lower conductor and, on the other hand, on the upper conductor. The upper conductor ( 220 ) forms a bridge above the lower conductor ( 210 ) and the cavity ( 240 ) forms, at a level where it emerges on the upper conductor ( 243 ), two vents on both sides of the latter.
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